Semiconductor Packaging News13h
IDC: Artificial Intelligence Will Contribute $19.9 Trillion to the Global Economy through 2030 and Drive 3.5% of Global GDP in 2030
IDC: Artificial Intelligence Will Contribute $19.9 Trillion to the Global Economy through 2030 and Drive 3.5% of Global GDP in 2030: Summary IDC's new research forecasts AI will c ...
Semiconductor Packaging News13h
Breaking The Circuit: US-China Semiconductor Controls – Analysis
The Biden administration's 2022 export controls slashed China’s semiconductor output by 17% in early 2023. Despite this, China adapts by developing domestic alternatives and bypassing restrictions ...
Semiconductor Packaging News13h
Intel lands Amazon as client for custom AI chips, a major win for its foundry business
Intel lands Amazon as client for custom AI chips, a major win for its foundry business: Summary Intel’s foundry business has signed Amazon Web Services as a multibillion-dollar ...
Semiconductor Packaging News13h
Semicon India 2024: PM Modi Pulls Out All the Stops for Local Chip Growth
Indian Prime Minister Narendra Modi hosted global semiconductor CEOs at the Semicon India 2024 event, showcasing India's ambitions to become a key semiconductor hub. Modi emphasized government ...
Semiconductor Packaging News13h
China seeks a homegrown alternative to Nvidia — these are some of the companies to watch
China seeks a homegrown alternative to Nvidia — these are some of the companies to watch: Summary U.S. sanctions have pushed China to accelerate its domestic semiconductor devel ...
Semiconductor Packaging News13h
Intel’s German plant delay lands blow to EU’s chip ambitions
Intel’s decision to delay its planned German semiconductor factory by two years deals a blow to the EU’s chip ambitions. The move frees up billions in subsidies, sparking debate over budget priorities ...
Semiconductor Packaging News13h
New mechanism explains rapid energy sharing across atomic semiconductor junctions
Researchers have discovered a new energy-sharing mechanism in semiconductors, where electrons cross atomically thin layers, generating heat almost instantly in both layers. This breakthrough could ...
Semiconductor Packaging News13h
Intel to make custom AI chip for AWS
Intel CEO Pat Gelsinger secured Amazon Web Services as a major customer, with a multiyear, multibillion-dollar deal to co-invest in AI semiconductor development. This boosts Intel's turnaround efforts ...
Semiconductor Packaging News13h
US-China decoupling disruption as opportunity not threat
Summary The economic decoupling between the U.S. and China is underway, driven by trade imbalances, tech competition, and security concerns. Third-party nations, like Vietnam and India, face new ...
Semiconductor Packaging News13h
Research Bits: Sept. 17
Researchers from NC State and Johns Hopkins created a DNA-based device capable of both data storage and computing. Using dendricolloids, they developed nanoscale fibers that preserve DNA for secure ...
Semiconductor Packaging News8d
Advanced IC substrate industry: exciting developments on the horizon
The advanced IC substrate market, currently dominated by organic core substrates, saw revenue decline in 2023, marking a year of correction. However, starting in 2024 ... Semiconductor Packaging News ...
Semiconductor Packaging News8d
DELO introduces new microelectronics adhesive for ultra-fine structures
DELO has developed a new adhesive that can be used to create ultra-fine structures within seconds. DELO DUALBOND EG4797 thus creates new possibilities in heterogeneous ... ELO has developed a new, ...