Semiconductor Packaging News6d
Advanced IC substrate industry: exciting developments on the horizon
The advanced IC substrate market, currently dominated by organic core substrates, saw revenue decline in 2023, marking a year of correction. However, starting in 2024 ... Semiconductor Packaging News ...
Semiconductor Packaging News6d
DELO introduces new microelectronics adhesive for ultra-fine structures
DELO has developed a new adhesive that can be used to create ultra-fine structures within seconds. DELO DUALBOND EG4797 thus creates new possibilities in heterogeneous ... ELO has developed a new, ...
Semiconductor Packaging News7d
Applied Ventures and ITIC Taiwan Joins Series B Funding For Wise-integration's 'Disruptive' Technology
Wise-integration announced that the investment fund, Applied Ventures-ITIC Innovation Fund (AVITIC), joined the company's Series B funding round. AVITIC is a joint ... Semiconductor Packaging News is ...
Semiconductor Packaging News6d
High Power Liquid Cooled Socket for Multi Chip Module
Constructed with stamped spring pin technology to accommodate 15+GHz bandwidth along with liquid cooling for dissipating 40+ watt to maintain temperature below ... Ironwood Electronics, Inc. and JF ...
Semiconductor Packaging News6d
MICRONOX MX2123 to Lead KYZEN Offerings at IMAPS
KYZEN will exhibit at The 2024 International Symposium on Microelectronics scheduled to take place October 1-3, 2024 at the Encore Boston Harbor. The KYZEN clean team ... KYZEN proudly announces its ...
Semiconductor Packaging News7d
MRSI Mycronic to Showcase Advanced Assembly Solutions at CIOE 2024
MRSI Mycronic, a part of the Mycronic Group, will be exhibiting and presenting innovative advanced assembly solutions at the 24th China International Optoelectronic Exposition ... MRSI Systems has ...
Semiconductor Packaging News7d
Q2 2024 Global Semiconductor Equipment Billings Increased 4% Year-Over-Year, SEMI Reports
Global semiconductor equipment billings increased 4% year-over-year to US$26.8 billion in the second quarter of 2024, while quarter-over-quarter billings edged up 1% ... SEMICON India 2024 will bring ...
Semiconductor Packaging News11d
ACM Research Expands FOPLP Portfolio with Launch of Ultra C bev-p Bevel Etching Tool
ACM Research, Inc. (ACM) announced the launch of its Ultra C bev-p panel bevel etching tool for fan-out panel-level packaging (FOPLP) applications. The new tool is ... Semiconductor Packaging News is ...
Semiconductor Packaging News3mon
KYZEN Announces Partnership with Added-Value Distributor ADTOOL Corporation
KYZEN will exhibit at The 2024 International Symposium on Microelectronics scheduled to take place October 1-3, 2024 at the Encore Boston Harbor. The KYZEN clean team ... KYZEN proudly announces its ...
Semiconductor Packaging News10d
ACM Research Receives Orders for WLP Tools from U.S. Customer and R&D Center
ACM Research, Inc. announced it has received purchase orders for four wafer-level packaging tools, including two from a U.S.-based customer and two from a U.S.-based ... Semiconductor Packaging News ...
Semiconductor Packaging News13d
Wise-integration Creates Subsidiary to Manage Asian Business Development and Spur Growth in China
We search for industry news so you don't need to. Semiconductor Packaging News is built for professionals who bear the responsibility of looking ahead, imagining the future, and preparing for it.
Semiconductor Packaging News11d
Syensqo to debut at Semicon Taiwan 2024
Syensqo, previously part of Solvay Group, will debut at Semicon Taiwan 2024 in Taipei with the materials portfolio covering all stages of semiconductor processing. ...