As part of the expanded collaboration, Intel will produce an AI fabric chip for AWS on Intel 18A, the company’s most advanced ...

NXP MC33777 battery junction box integrated circuit (IC) integrates critical pack-level functions into a single device.

In recent quarters, mixed reality (MR) headsets took a leap forward in fidelity, first with the launch of the Quest 3 and ...

Chip production on 300mm wafers is technologically more advanced and significantly more efficient compared to 200mm wafers, ...

Being a venture capitalist carries a lot of prestige in Silicon Valley. Those who choose which startups to fund see ...

ACA TMETRIX DCP-X probe is designed for engineers and scientists in device characterization, R&D, and testing, offering ...

Last year, industry global sales reached $527 billion and nearly 1 trillion semiconductors were sold globally, more than 100 ...

Canada needs to seize opportunities to secure its place in the changing global trade landscape, Bank of Canada governor Tiff ...

Global satellite operator Telesat has selected Calian Group Ltd., an Ottawa-based provider of space and defence tech ...

Weidmuller Canada recently opened a new Customer Experience Centre at its headquarters in Markham ON. The state-of-the-art ...

Boeing signed a contract with MicroPilot, involved in UAV autopilots, to support the further advancement of MicroPilot’s ...

STACKPOLE ELECTRONICS RMCA series of AECQ200 qualified automotive-grade chip resistors provide improved long-term reliability ...